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  1. Engineering Information
  2. Semiconductors

Package

Package Line-up

* Recommendation Land Pattern is a reference value. To design practically, correction(s) should be mode for optimized dimensions considering
the effects of the board type to be mounted, mount(soldering) method, type and coating thickness of cream solder.

Package Type Pin Count Package Name Package Size (mm) Pin Pitch (mm) MOQ Weight *Reference value Soldering Conditions (Maximum counts)
He D A C Qty/Reel g/Part Reflow Flow Soldering Iron
Flat Lead Type 6 SON-6C 2.00 1.60 0.55 0.50 5,000 0.004 2 N/A 2
6 SON-6F 1.60 1.60 0.60 0.50 5,000 0.004 2 N/A 2
5 SOT89-5A 4.25 4.50 1.50 1.50 1,000 0.055 2 N/A 2
Package Type Pin Count Package Name Package Size (mm) Pin Pitch (mm) MOQ Weight *Reference value Soldering Conditions (Maximum counts)
He D A C Qty/Reel g/Part Reflow Flow Soldering Iron
Gullwing Type 8 HSOP-8A 6.20 5.00 1.55 1.27 2,000 0.086 2 N/A 2
8 HSOP-8D 6.00 4.90 1.55 1.27 2,500 0.072 2 N/A 2
8 HSOP-8E 6.00 5.02 1.53 0.805 4,000 0.077 2 N/A 2
4 SC-82ABA 2.10 2.00 0.95 1.30 3,000 0.006 2 1 2
4 SC-82ABB 2.10 2.00 0.90 1.30 3,000 0.006 2 1 2
6 SC-88A 2.10 2.00 0.90 0.65 3,000 0.006 2 1 2
3 SOT-23A 2.80 2.90 1.15 1.90 3,000 0.013 2 1 2
5 SOT-25A 2.80 2.90 1.15 0.95 3,000 0.015 2 1 2
6 SOT-26A 2.80 2.90 1.15 0.95 3,000 0.016 2 1 2
6 SOT-26B 2.80 2.90 1.15 0.95 3,000 0.014 2 1 2
8 SOP-8C 6.20 5.20 1.55 1.27 2,000 0.070 2 1 2
8 SOP-8D 6.20 5.00 1.55 1.27 2,000 0.080 2 1 2
8 SOP-8G 6.20 5.20 1.55 1.27 2,000 0.077 2 1 2
8 SOP-8J 6.20 5.02 1.65 1.27 4,000 0.079 2 1 2
16 SOP-10A 6.20 5.00 1.55 1.00 2,000 0.083 2 1 2
16 SOP-16A 8.00 10.00 1.95 1.25 1,000 0.210 2 1 2
16 SOP-16B 6.20 10.20 1.55 1.27 2,000 0.140 2 1 2
3 TO-252C 9.90 6.60 2.30 2.30 3,000 0.320 2 N/A 2
5 TO-252-5A 9.90 6.60 2.30 1.27 3,000 0.336 2 N/A 2
8 TSOP-8A 3.10 2.00 0.75 0.50 3,000 0.009 2 N/A 2
16 TSOP-16B 6.40 5.00 1.10 0.65 2,000 0.063 2 N/A 2
16 TSOP-16D 6.40 5.00 1.10 0.65 2,000 0.055 2 N/A 2
20 TSOP-20D 6.40 6.50 1.10 0.65 2,000 0.084 2 N/A 2
20 TSOP-20E 6.40 6.50 1.10 0.65 3,000 0.084 2 N/A 2
20 TSOP-20F 6.40 6.50 1.20 0.65 2,500 0.081 2 N/A 2
20 TSOP-20G 4.40 6.50 1.10 0.65 2,000 0.084 2 N/A 2
8 VSOP-8C 4.00 2.95 1.30 0.65 3,000 0.022 2 N/A 2
8 VSOP-8D 4.00 2.80 1.30 0.65 3,000 0.022 2 N/A 2
8 VSOP-8E 4.00 2.80 1.30 0.65 2,500 0.023 2 N/A 2
24 VSOP-20A 7.60 8.66 1.63 0.635 2,500 0.130 2 N/A 2
24 VSOP-24A 7.60 7.90 1.25 0.65 2,000 0.130 2 N/A 2
6 SOT-26E 2.80 2.90 1.15 0.95 3,000 0.016 2 1 2
Package Type Pin Count Package Name Package Size (mm) Pin Pitch (mm) MOQ Weight *Reference value Soldering Conditions (Maximum counts)
He D A C Qty/Reel g/Part Reflow Flow Soldering Iron
Non-Lead Type 4 PLP-4A 1.00 1.00 0.65 0.65 5,000 0.001 2 N/A N/A
4 PLP-4C 1.00 1.00 0.65 0.65 10,000 0.001 2 N/A N/A
4 PLP-4E 2.85 1.25 0.50 0.500 5,000 0.005 2 N/A N/A
6 PLP-6C 1.20 1.20 0.60 0.40 5,000 0.001 2 N/A N/A
6 PLP-6G 4.10 2.10 0.50 0.50 5,000 0.011 2 N/A N/A
6 PLP-6H 1.80 1.70 0.50 0.50 5,000 0.004 2 N/A N/A
6 PLP-6J 2.00 1.40 0.50 0.45 5,000 0.004 2 N/A N/A
8 PLP-8F 3.00 2.00 0.60 0.50 5,000 0.009 2 N/A N/A
8 PLP-8G 2.40 2.60 0.60 0.50 5,000 0.009 2 N/A N/A
8 PLP-8H 1.80 1.80 0.58 0.45 5,000 0.005 2 N/A N/A
10 PLP-10A 2.50 2.70 0.60 0.50 5,000 0.010 2 N/A N/A
10 PLP-10D 3.00 3.00 0.60 0.50 5,000 0.013 2 N/A N/A
12 PLP-12A 4.00 2.90 0.60 0.40 2,000 0.016 2 N/A N/A
12 PLP-12B 3.00 3.00 0.60 0.50 2,000 0.013 2 N/A N/A
24 PLP-24A 3.00 3.00 0.60 0.40 5,000 0.012 2 N/A N/A
16 SQFN-16A 3.00 3.00 0.75 0.50 3,000 0.018 2 N/A N/A
16 SQFN-16B 4.00 4.00 0.75 0.50 2,500 0.021 2 N/A N/A
24 SQFN-24A 5.00 5.00 0.75 0.50 2,000 0.034 2 N/A N/A
32 SQFN-32A 5.00 5.00 0.75 0.50 3,000 0.056 2 N/A N/A
4 SSON-4B 1.40 1.10 0.55 0.50 3,000 0.002 2 N/A N/A
6 SSON-6A 2.00 1.80 0.75 0.50 3,000 0.006 2 N/A N/A
6 SSON-6E 1.60 1.80 0.55 0.50 3,000 0.005 2 N/A N/A
6 SSON-6J 1.40 1.40 0.55 0.50 3,000 0.003 2 N/A N/A
6 SSON-6L 2.00 2.00 0.75 0.65 3,000 0.008 2 N/A N/A
6 SSON-6M 1.40 1.40 0.55 0.50 3,000 0.003 2 N/A N/A
6 SSON-6N 3.60 1.80 0.65 0.35 3,000 0.011 2 N/A N/A
6 SSON-6U 1.80 1.40 0.40 0.50 5,000 0.002 2 N/A N/A
6 SSON-6V 1.80 1.40 0.40 0.50 5,000 0.002 2 N/A N/A
8 SSON-8B 2.30 2.30 0.75 0.50 3,000 0.010 2 N/A N/A
8 SSON-8E 2.00 2.00 0.75 0.50 6,000 0.008 2 N/A N/A
8 SSON-8G 1.60 1.60 0.55 0.40 5,000 0.004 2 N/A N/A
10 SSON-10A 2.50 2.70 0.55 0.50 5,000 0.012 2 N/A N/A
10 SSON-10B 2.50 2.70 0.55 0.50 5,000 0.012 2 N/A N/A
16 SSON-16A 3.20 5.50 0.60 0.50 2,000 0.035 2 N/A N/A
4 WLCSP-4E 0.62 0.62 0.40 0.35 10,000 0.001 2 N/A N/A
6 WLCSP-6B 0.81 1.09 0.46 0.40 5,000 0.001 2 N/A N/A
15 WLCSP-15A 1.46 2.61 0.58 0.50 5,000 0.005 2 N/A N/A
3 SOT89-3A 4.0 4.50 1.50 1.50 1,000 0.050 2 N/A N/A
8 SSON-8F 1.60 1.60 0.55 0.20 5,000 0.004 2 N/A N/A
24 SQFN-24B 4.00 4.00 0.85 0.50 2,500 0.041 2 N/A N/A
6 SSON-6K 2.0 2.0 0.75 0.65 3,000 0.008 2 N/A N/A

Engineering Information for Semiconductors

Basic Knowledge

What is an IC (integrated circuit)?
What is a CPU?
What is memory (semiconductor memory)?
What is a power semiconductor?
What are the functions of a DC-DC converter?
What is an operational amplifier?
What is a shunt regulator?

Technical Data

Package Detail: Dimensional Drawing, Recommended Land Pattern
Package

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